肉乳床欢无码a片120秒厨房里 ,国产伦精品一区二区三区妓女

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.


LM5025A Die
Active Clamp Voltage Mode PWM Controller

DIE/WAFER CHARACTERISTICS

Fabrication Attributes		General Die Information
Physical Die Identification	LM5025A	Bond Pad Opening Size (min)	91μm x 91μm
Die Step	A	Bond Pad Metalization	Al_ 0.5%Cu
Physical Attributes		Passivation	PECVDOX+NITRIDE
Wafer Diameter	150mm	Back Side Metal	BARE BACK
Die Size (Drawn)	2286μm x 2540μm 90.0mils x 100.0mils	Back Side Connection	Floating
Thickness	254μm Nominal
Min Pitch	167μm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.

LM5025 MDC MWC ACTIVE CLAMP VOLTAGE MODE PWM CONTROLLER

Use of cookies

We use cookies and similar technologies (also from third parties) to collect your deviceand browser information for a better understanding on how you use our online offerings.This enables us to optimize and personalize your experience with Ramsun and to provideyou with additional services and information based on your individual profile. Details areavailable in our privacy policy where you can also change your preferences on cookies atany time.

bl肉yin荡np公厕肉便,含一整夜好涨h,gogogo日本免费观看,一本色道久久综合亚洲精品

Tel

bl肉yin荡np公厕肉便,含一整夜 好涨h,gogogo日本免费观看,一本色道久久综合亚洲精品

Tel

bl肉yin荡np公厕肉便,含一整夜好涨h,gogogo日本免费观看,一本色道久久综合亚洲精品